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Forward Citations = 7

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9 inventors (with patents filed for the assignee):

Amlan Sen (10 out of 12 patents)

Navaneetha Kumaran Baheerathan (3 out of 3 patents)

Qing Feng Guan (3 out of 3 patents)

4. Wai Hoe Lee (3 out of 3 patents)

5. Chian Soon Chua (2 out of 2 patents)

6. Hwee Seng Chew (1 out of 6 patents)

7. Li Jiang Huang (1 out of 1 patent)

8. Siew Wen Lee (1 out of 1 patent)

9. Kin Fei Chooi (1 out of 1 patent)

10 patents: Sort by Forward Citations

1. 12270119 - Plating apparatus and operation method thereof (2025-04-08),

2. 12183620 - Apparatus and method for bonding a plurality of dies to a carrier panel (2024-12-31),

3. 11990445 - Apparatus and method for semiconductor device bonding (2024-05-21),

4. 11817326 - Precision reconstruction for panel-level packaging (2023-11-14),

5. 11810797 - Wetting processing apparatus and operation method thereof (2023-11-07),

6. 11552043 - Post bond inspection of devices for panel packaging (2023-01-10),

7. 11518070 - Compression molding machine and method of compression molding (2022-12-06),

8. 11456259 - Panel level packaging for devices (2022-09-27),

9. 11261535 - Plating apparatus and operation method thereof (2022-03-01),

10. 11107716 - Automation line for processing a molded panel (2021-08-31),

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USPTO Data Jan 1 1976 - Dec 30 2025

10 Patents

#197 in Singapore

#198 in Singapore

#54,324 in the World

Singapore, Singapore

Pyxis Cf Pte. Ltd.