Li Jiang Huang

Title: The Innovative Mind of Li Jiang Huang

Introduction: Li Jiang Huang, an inventive spirit from Singapore, has made significant strides in the field of die bonding technology. With one patent to his name, he showcases a deep understanding of the complexities involved in efficiently bonding dies to carrier panels.

Latest Patents: Huang's notable patent, titled "Apparatus and method for bonding a plurality of dies to a carrier panel," outlines a sophisticated die bonding apparatus. This innovative device consists of a carrier support unit that features a supporting plane and a carrier holder, which supports the carrier panel in a parallel orientation. The design also includes a wafer feed unit, designed to hold diced wafers while maintaining a strategic orientation that allows for optimal bonding. Essential to the invention is the die transfer module, which seamlessly moves dies from the diced wafer to the carrier panel, enhancing efficiency and accuracy in the bonding process.

Career Highlights: Currently employed at Pyxis Cf Pte. Ltd., Huang has excelled in his role, contributing to advancements in semiconductor manufacturing technologies. His expertise lies in optimizing processes and increasing the reliability of electronic components through innovative methodologies.

Collaborations: Huang's drive for innovation is further exemplified through collaborations with skilled professionals such as Hwee Seng Chew and Amlan Sen. Together, they work towards enhancing the capabilities and applications of bonding technologies in the electronics field.

Conclusion: Li Jiang Huang stands out as a remarkable inventor whose innovative contributions pave the way for advancements in die bonding techniques. With a commitment to excellence and collaboration, he continues to influence the landscape of semiconductor technology in Singapore and beyond.