Company Filing History:
Years Active: 2023
Title: Innovator Chian Soon Chua: Advancements in Panel-Level Packaging
Introduction: Chian Soon Chua, located in Singapore, SG, is a notable inventor recognized for his contributions to the field of panel-level packaging (PLP). With a total of two patents to his name, Chua's innovations focus on enhancing the accuracy and efficiency of die bonding processes in semiconductor manufacturing.
Latest Patents: Chua's latest patents showcase his expertise in precision reconstruction for panel-level packaging. His first patent emphasizes panel-level packaging with high positional accuracy of dies. This innovation accurately bonds dies to specific regions of an alignment panel by utilizing local alignment marks. This method ensures that the reconstructed wafer maintains precise positioning of dies, enabling efficient scanning through a die location check (DLC) process based on sub-blocks of dies. The outcome of this scan generates a comprehensive DLC file containing coordinate points that facilitate further processing. Additionally, Chua has developed a laser direct imaging (LDI) file through the alignment of sub-block circuit files to the generated DLC file, significantly improving throughput and accuracy.
Chua's second patent addresses the post-bond inspection of devices for panel packaging. This innovation also focuses on high accuracy and scalability during the PLP process. By employing a carrier configured with die bond regions, both pre-bond and post-bond inspections are conducted to verify the precise bonding of dies to the carrier, reinforcing the reliability of the manufacturing process.
Career Highlights: Chian Soon Chua has established himself as a respected professional in the semiconductor industry. His work at Pyxis Cf Pte. Ltd. has allowed him to contribute significantly to advancements in die bonding techniques and packaging efficiency.
Collaborations: Throughout his career, Chua has collaborated with esteemed colleagues in the industry, including Amlan Sen and Wai Hoe Lee. These collaborations have been pivotal in enhancing research and development efforts within the firm, leading to impactful innovations in the field.
Conclusion: Chian Soon Chua's contributions to the development of panel-level packaging technology underline his status as a key inventor in the semiconductor domain. His patents reflect a commitment to improving manufacturing precision and throughput, ultimately advancing the industry standards for die bonding and inspection processes.