The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Dec. 30, 2020
Applicant:
Pyxis CF Pte. Ltd., Singapore, SG;
Inventors:
Amlan Sen, Singapore, SG;
Chian Soon Chua, Singapore, SG;
Wai Hoe Lee, Singapore, SG;
Qing Feng Guan, Singapore, SG;
Assignee:
PYXIS CF PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/681 (2013.01); H01L 2224/80132 (2013.01);
Abstract
Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP includes dies bonded face down onto an alignment carrier configured with die bond regions. Pre-bond and post bond inspection are performed at the carrier level to ensure accurate bonding of the dies to the carrier.
Quick Actions:
Sen, Amlan. (2023). Post bond inspection of devices for panel packaging (U.S. Patent No. 11552043). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11552043
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile