Qing Feng Guan

Title: Innovations of Qing Feng Guan

Introduction

Qing Feng Guan is a notable inventor based in Singapore, recognized for his contributions to the field of die bonding technology. With a total of three patents to his name, he has made significant advancements that enhance the efficiency and accuracy of panel-level packaging processes.

Latest Patents

One of his latest patents is titled "Apparatus and method for bonding a plurality of dies to a carrier panel." This invention features a die bonding apparatus that includes a carrier support unit, a wafer feed unit, and a die transfer module. The design allows for precise transfer of dies from a diced wafer to a carrier panel, ensuring that the dies are accurately positioned.

Another significant patent is "Precision reconstruction for panel-level packaging." This innovation focuses on achieving high positional accuracy of dies during the bonding process. By utilizing local alignment marks on die bonding regions, the technology ensures that dies are accurately bonded to an alignment panel. This results in a reconstructed wafer with precise die positioning, which can be efficiently scanned for quality checks.

Career Highlights

Qing Feng Guan is currently employed at Pyxis Cf Pte. Ltd., where he continues to develop cutting-edge technologies in the field of semiconductor packaging. His work has been instrumental in advancing the capabilities of die bonding techniques, contributing to the overall efficiency of manufacturing processes.

Collaborations

He collaborates with talented individuals such as Amlan Sen and Wai Hoe Lee, who contribute to the innovative environment at Pyxis Cf Pte. Ltd. Their combined expertise fosters a culture of creativity and technological advancement.

Conclusion

Qing Feng Guan's innovative patents and contributions to the field of die bonding technology highlight his role as a leading inventor in Singapore. His work continues to influence the semiconductor industry, paving the way for future advancements.