Amlan Sen, an accomplished inventor based in Singapore, has made significant strides in the field of semiconductor technology. He holds a remarkable total of 11 patents, showcasing his expertise and innovative contributions to the industry. His inventions focus primarily on apparatus and methods for bonding technology, which play a crucial role in the semiconductor manufacturing process.

Latest Patents

Among Amlan Sen’s latest patents are two groundbreaking innovations:

1. **Apparatus and Method for Bonding a Plurality of Dies to a Carrier Panel** - This die bonding apparatus features a carrier support unit that includes at least one support element defining a supporting plane. A carrier holder supports the carrier panel parallel to this supporting plane. Additionally, a wafer feed unit with a wafer holder holds a diced wafer, ensuring it remains spaced apart from the supporting plane. The die transfer module facilitates the transfer of dies from the diced wafer to the carrier panel, enhancing efficiency in semiconductor assembly.

2. **Apparatus and Method for Semiconductor Device Bonding** - This innovative apparatus incorporates a bonding assembly with a bonding head equipped with a bonding tool to hold a semiconductor device. The bonding head actuation mechanism allows for precise horizontal alignment of the semiconductor device with respect to a substrate. The assembly further includes a vision assembly with alignment cameras to capture reference views, ensuring accurate positioning for optimal bonding results.

Career Highlights

Amlan Sen has worked at prominent companies such as Pyxis CF Pte. Ltd. and Orion Systems Integration Pte Ltd., where he developed and honed his skills in semiconductor technology. His work has been pivotal in advancing the methodologies behind semiconductor bonding, showcasing his commitment to innovation in this competitive field.

Collaborations

Amlan has collaborated with esteemed colleagues including Wai Hoe Lee and Qing Feng Guan, sharing knowledge and expertise to drive advancements in their projects. These partnerships have further enhanced the innovative outcomes of their collective efforts, paving the way for future breakthroughs in the industry.

Conclusion

In summary, Amlan Sen exemplifies the spirit of innovation in the semiconductor sector through his impressive portfolio of patents and collaborative endeavors. His contributions have not only advanced the technology used in semiconductor bonding but have also set a foundation for future innovations in the field. As he continues to explore new avenues and enhance his inventions, Amlan stands as a prominent figure in the landscape of modern technology.

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