The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Nov. 09, 2009
Hwee Seng Chew, Singapore, SG;
Chee Kian Ong, Singapore, SG;
Kian Hock Lim, Singapore, SG;
Amlan Sen, Singapore, SG;
Shoa Siong Lim, Singapore, SG;
Hwee Seng Chew, Singapore, SG;
Chee Kian Ong, Singapore, SG;
Kian Hock Lim, Singapore, SG;
Amlan Sen, Singapore, SG;
Shoa Siong Lim, Singapore, SG;
ORION SYSTEMS INTEGRATION PTE LTD, Singapore, SG;
Abstract
A method for fabricating a flip-chip semiconductor package. The method comprises processing a semiconductor device, for example a semiconductor chip and processing a device carrier, for example a substrate. The semiconductor device comprises bump structures formed on a surface thereof. The substrate comprises bond pads formed on a surface thereof. Processing of the semiconductor chip results in heating of the semiconductor chip to a chip process temperature. The chip process temperature melts solder portions on the bump structures Processing of the substrate results in heating of the substrate to a substrate process temperature. The method comprises spatially aligning the semiconductor chip in relation to the substrate to correspondingly align the bump structures in relation to the bump pads. The semiconductor chip is then displaced towards the substrate for abutting the bump structures of the semiconductor chip with the bond pads of the substrate to thereby form bonds therebetween. A system for performing the above method is also disclosed.