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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11107716 B1

PDFFull Text
Date of Patent:
Aug. 31, 2021

Filed:

Feb. 06, 2020

Automation line for processing a molded panel

Applicant:

Pyxis CF Pte. Ltd., Singapore, SG;

Inventor:

Amlan Sen, Singapore, SG;

Assignee:

PYXIS CF PTE. LTD., Singapore, SG;

Attorneys:

Daniel F. Nesbitt

Hasse & Nesbitt LLC

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/673 (2006.01); H01L 23/60 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67706 (2013.01); H01L 21/67103 (2013.01); H01L 21/67173 (2013.01); H01L 21/67259 (2013.01); H01L 21/67333 (2013.01); H01L 21/68 (2013.01); H01L 21/6835 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 23/60 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01);
Abstract

An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.

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