Enter assignee name

Forward Citations = 10

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5 inventors (with patents filed for the assignee):

Jimmy Chew (5 out of 7 patents)

Hwee Seng Jimmy Chew (5 out of 7 patents)

Yi Xin Chew (2 out of 3 patents)

4. Hwee Seng Chew (1 out of 6 patents)

5. Senthil Kumar Munirathinam (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 12080565 - Chip packaging method and package structure (2024-09-03),

2. 11990431 - Semiconductor structures with via openings and methods of making the same (2024-05-21),

3. 11990353 - Semiconductor device with buffer layer (2024-05-21),

4. 11881415 - Method of packaging chip and chip package structure (2024-01-23),

5. 11610855 - Chip packaging method and package structure (2023-03-21),

6. 11538695 - Packaging method, panel assembly, wafer package and chip package (2022-12-27),

7. 11114315 - Chip packaging method and package structure (2021-09-07),

8. 11062917 - Packaging method, panel assembly, wafer package and chip package (2021-07-13),

9. 11049734 - Method of packaging chip and chip package structure (2021-06-29),

10. 10854531 - Semiconductor packaging method, semiconductor package and stacked semiconductor packages (2020-12-01),

11. 10615056 - Method of packaging chip and chip package structure (2020-04-07),

12. 10504850 - Semiconductor processing method (2019-12-10),

13. 10431477 - Method of packaging chip and chip package structure (2019-10-01),

Pep Innovation Pte. Ltd. is a leading technology solutions provider that specializes in creating innovative software products for businesses. With a strong focus on research and development, Pep Innovation is committed to delivering cutting-edge solutions to help clients stay ahead in the competitive market. Our team of experienced professionals is dedicated to providing top-notch services and support to ensure the success of our clients' projects.

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USPTO Data Jan 1 1976 - Dec 2 2025

13 Patents

#155 in Singapore

#156 in Singapore

#43,583 in the World

Singapore, Singapore

Pep Innovation Pte. Ltd.