The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jun. 24, 2016
Applicant:
Pep Innovation Pte Ltd., Singapore, SG;
Inventor:
Yi Xin Chew, Singapore, SG;
Assignee:
PEP INNOVATION PTE LTD., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 21/4846 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/76802 (2013.01); H01L 23/4334 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 25/105 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/19 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/24247 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/96 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier () having a plurality of semiconductor chip receiving areas () and attaching a plurality of first semiconductor chips () to the semiconductor chip receiving areas (). The first semiconductor chips () are encapsulated with a first encapsulant () and a plurality of electrical connections () is formed to the first semiconductor chips (). At least a portion of the carrier () is removed to provide a heat release area ().