The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jun. 24, 2016
Pep Innovation Pte Ltd., Singapore, SG;
Yi Xin Chew, Singapore, SG;
PEP INNOVATION PTE LTD., Singapore, SG;
Abstract
A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier () having a plurality of semiconductor chip receiving areas () and attaching a plurality of first semiconductor chips () to the semiconductor chip receiving areas (). The first semiconductor chips () are encapsulated with a first encapsulant () and a plurality of electrical connections () is formed to the first semiconductor chips (). At least a portion of the carrier () is removed to provide a heat release area ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile