The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Aug. 12, 2016
Applicant:
Pep Innovation Pte Ltd, Singapore, SG;
Inventor:
Yi Xin Chew, Singapore, SG;
Assignee:
PEP INNOVATION PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 23/32 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/32 (2013.01); H01L 24/00 (2013.01); H01L 24/97 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/19 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor processing method is provided. The method includes providing a first carrier (). A first adhesive () is provided on the first carrier () and a plurality of semiconductor chips () is placed on the first adhesive (). A second carrier () is provided. The second carrier () is provided with a plurality of chip receiving areas (). The first and second carriers () and () are then brought together to attach the semiconductor chips () to respective ones of the chip receiving areas () on the second carrier (). The first carrier () is then separated from the semiconductor chips ().