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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11990353 B1

PDFFull Text
Date of Patent:
May. 21, 2024

Filed:

Jul. 15, 2021

Semiconductor device with buffer layer

Applicant:

Pep Innovation Pte. Ltd., Singapore, SG;

Inventors:

Hwee Seng Jimmy Chew, Singapore, SG;

Senthil Kumar Munirathinam, Singapore, SG;

Assignee:

PEP INNOVATION PTE. LTD., Singapore, SG;

Attorney:

Javalon Law, PC

Primary Examiner:

Thanhha S Pham

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 25/0657 (2013.01); H01L 23/5389 (2013.01); H01L 2223/5448 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A wafer-level buffer layer is disclosed. The wafer-level buffer layer is configured to prevent cracking and chipping the back-end-of-line (BEOL) dielectric during wafer singulation process. The wafer-level buffer layer is a composite wafer-level buffer layer with a vibration damping agent. The vibration damping agent includes a polymer-based base layer with fillers. The damping agent absorbs or dampens the vibration of the saw blade during dicing to prevent cracking and chipping of the BEOL dielectric.

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Chew, Hwee Seng Jimmy. (2024). Semiconductor device with buffer layer (U.S. Patent No. 11990353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11990353

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