The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Oct. 22, 2021
Pep Innovation Pte. Ltd., Singapore, SG;
Hwee Seng Chew, Singapore, SG;
PEP INNOVATION PTE. LTD., Singapore, SG;
Abstract
The present disclosure provides a chip package for power modules including at least one semiconductor die; a driver circuit for controlling the at least one semiconductor die; a protective layer formed on a die active surface of the at least one die and a driver active surface of the driver circuit; a metal unit having at least one metal feature; and a molding layer for encapsulating the at least one semiconductor die, the driver circuit, the protective layer and metal unit. The chip package is connected with an external circuit via the at least one metal feature. The present disclosure also provides a method of making the chip packages for power modules.