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Pac Tech Packaging Technologies G.m.b.h.

USPTO Granted Patents = 55

EPO Patents = 26

Trademarks = 10

Forward Citations = 350

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28 inventors (with patents filed for the assignee):

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (7 out of 9 patents)

4. Andrej Kolbasow (7 out of 8 patents)

5. Paul Kasulke (7 out of 15 patents)

6. Thorsten Krause (5 out of 5 patents)

7. Thorsten Teutsch (4 out of 4 patents)

8. Siavash Hosseinpour Tabrizi (3 out of 3 patents)

9. Hans-Hermann Oppermann (2 out of 17 patents)

10. Lars Titerle (2 out of 5 patents)

11. Kaveh Momeni (2 out of 2 patents)

12. Nico Lange (2 out of 2 patents)

13. Andreas Ostmann (1 out of 13 patents)

14. Jan Hoffmann (1 out of 1 patent)

15. Martin Lange (1 out of 17 patents)

55 patents: Sort by Forward Citations

1. 12358084 - Bonding head and bonding apparatus (2025-07-15),

2. 12349287 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2025-07-01),

3. 12171066 - Method for removing and repositioning electronic components connected to a circuit board (2024-12-17),

4. 12048972 - Method and device including laser heating of gripper for repairing a test contact arrangement (2024-07-30),

5. 12028987 - Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole (2024-07-02),

6. 12023756 - Method for removing electronic components connected to a circuit board (2024-07-02),

7. 11618094 - Solder ball feeding device (2023-04-04),

8. 11554434 - Method and laser arrangement for fusing a solder material deposit by means of laser energy (2023-01-17),

9. 11367709 - Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement (2022-06-21),

10. 11224928 - Device for the separate application of solder material deposits (2022-01-18),

11. 11217558 - Method and device for establishing a wire connection as well as a component arrangement having a wire connection (2022-01-04),

12. 10914759 - Method for placing and contacting a test contact (2021-02-09),

13. 10695853 - Device for the separate application of bonding material deposits (2020-06-30),

14. 10634699 - Device for removing a test contact of a test contact arrangement (2020-04-28),

15. 10354971 - Method for producing a chip module (2019-07-16),

Pac Tech Packaging Technologies G.m.b.H. is a leading global provider of advanced packaging solutions for various industries. With a focus on semiconductor packaging, Pac Tech offers innovative products and processes to ensure reliable and efficient packaging for electronic components. Their state-of-the-art manufacturing facilities and experienced team enable them to deliver high-quality, customized packaging solutions that meet customer requirements. For more information, please visit their website.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 2 2025

55 Patents

#1 in Nauen

#999 in Germany

#12,525 in the World

Pac Tech Packaging Technologies G.m.b.h.

Forward Citations = 350

28 inventors:

Ghassem Azdasht (35 out of 53 patents)

Elke Zakel (19 out of 45 patents)

Matthias Fettke (7 out of 9 patents)

4. Andrej Kolbasow (7 out of 8 patents)

5. Paul Kasulke (7 out of 15 patents)

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