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For the Inventor, By the Inventor

Suitashi, Japan

Nihon Superior Co., Ltd.

USPTO Granted Patents = 15

% Expired Patents = 13.3


Trademarks = 4

Forward Citations = 36

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19 inventors (with patents filed for the assignee):

goldMedal Tetsuro Nishimura (14 out of 24 patents)

silverMedal Takatoshi Nishimura (3 out of 3 patents)

bronzeMedal Kazuhiro Nogita (2 out of 2 patents)

4.  Stuart David McDonald (2 out of 2 patents)

5.  Teruo Komatsu (2 out of 8 patents)

6.  Tetsuya Akaiwa (2 out of 2 patents)

7.  Hideki Yoshida (1 out of 6 patents)

8.  Shoichi Suenaga (1 out of 1 patent)

9.  Takashi Nozu (1 out of 1 patent)

10.  Motonori Miyaoka (1 out of 1 patent)

11.  Yasufumi Shibata (1 out of 1 patent)

12.  Yutaka Fukushima (1 out of 1 patent)

13.  Jonathan James Read (1 out of 1 patent)

14.  Tina Ventura (1 out of 1 patent)

15.  Toshimi Shimizu (1 out of 18 patents)


15 patents:

1. 12521822 - Sn solder paste comprising cu-co metal particles (2026-01-13),
2. 12377501 - Solder preform containing Cu—Co particles (2025-08-05),
3. 12172242 - Lead-free solder alloy (2024-12-24),
4. 11980974 - Solder joint part and method for manufacturing the same (2024-05-14),
5. 11839937 - Lead-free solder alloy and solder joint part (2023-12-12),
6. 10427220 - Nanoparticle production method, production device and automatic production device (2019-10-01),
7. 10329642 - Solder alloy and joint thereof (2019-06-25),
8. 10286497 - Lead-free solder alloy (2019-05-14),
9. 9999945 - Solder alloy (2018-06-19),
10. 9999936 - Solder wire bobbinless coil (2018-06-19),
11. 9956610 - Oxygen source-containing composite nanometal paste and joining method (2018-05-01),
12. 9339893 - Lead-free solder alloy (2016-05-17),
13. 8652269 - Flux composition and soldering paste composition (2014-02-18),
14. 5487868 - Tin based solder alloy containing lead, antimony, and tellurium (1996-01-30),
15. 5417771 - Soldering flux (1995-05-23),
Company Overview
Nihon Superior Co., Ltd. is a Japanese company specializing in the development and manufacturing of advanced soldering materials and related technologies. The organization focuses on creating innovative solutions for electronics assembly, particularly in the fields of lead-free solder and flux formulations. With a commitment to quality and sustainability, Nihon Superior serves a global market, providing essential materials that enhance the performance and reliability of electronic devices.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

15 Patents

#2 in Suitashi

#3,447 in Japan

#39,959 in the World

Suitashi, JP
Suitashi, Japan

Nihon Superior Co., Ltd.

Forward Citations = 36

19 inventors:

goldMedal Tetsuro Nishimura (14 out of 24 patents)

silverMedal Takatoshi Nishimura (3 out of 3 patents)

bronzeMedal Kazuhiro Nogita (2 out of 2 patents)

4.  Stuart David McDonald (2 out of 2 patents)

5.  Teruo Komatsu (2 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nihon Superior Co., Ltd.. Retrieved from https://idiyas.com/company/nihon-superior-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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