This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Nihon Superior Co., Ltd.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: The Innovations of Shoichi Suenaga
Introduction: Shoichi Suenaga is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of solder alloys, particularly in enhancing joint strength through innovative techniques. His work has implications for various industries that rely on reliable soldering methods.
Latest Patents: Suenaga holds a patent for a solder alloy and joint thereof. This invention features a silver electrode joint that achieves high joint strength by minimizing the particle size of a silver-zinc intermetallic compound during solidification. The solder alloy comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese, with the balance consisting of tin. The resulting joint interface has a particle size of 5 micrometers or less, ensuring superior performance.
Career Highlights: Suenaga is associated with Nihon Superior Co., Ltd., where he has been instrumental in developing advanced soldering materials. His expertise in solder alloys has positioned him as a key figure in the industry, contributing to the company's reputation for innovation.
Collaborations: Some of his notable coworkers include Tetsuro Nishimura and Takashi Nozu. Their collaborative efforts have furthered the research and development of soldering technologies.
Conclusion: Shoichi Suenaga's contributions to solder alloy technology exemplify the impact of innovative thinking in engineering. His patent reflects a commitment to enhancing joint strength and reliability in soldering applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile