This inventor holds 24 USPTO granted patents and 8 published patent applications, plus 2 CIPO patents and 12 EPO patents, primarily in Lead-Free Solder Alloys. Top assignees: Nihon Superior Co., Ltd., Nihon Superior Sha Co., Ltd., The University of Queensland. Active years: 1995-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Nishinomiya, JP (1995)
- Osaka, JP (1996 - 2023)
- Suita, JP (2001 - 2024)
Company Filing History:
14 out of 15 
7 out of 8 
2 out of 345 
Years Active: 1995-2026
Areas of Expertise:
Title: Tetsuro Nishimura: A Pioneer in Lead-Free Solder Innovations
Introduction
Tetsuro Nishimura is an esteemed inventor based in Osaka, Japan, known for his significant contributions to the field of solder technology. With a remarkable portfolio comprising 22 patents, his innovative solutions focus on developing environmentally friendly lead-free solder materials and advanced manufacturing techniques.
Latest Patents
Among his latest inventions, Tetsuro Nishimura has developed a lead-free solder alloy that comprises silver (Ag), copper (Cu), iron (Fe), nickel (Ni), gallium (Ga), and tin (Sn). This innovative alloy contains Ag in amounts ranging from 0.3 to 4.0% by mass, Cu from 0.1 to 2.0% by mass, Fe from 0.005 to 0.05% by mass, Ni from 0.01 to 0.5% by mass, and Ga from 0.001 to 0.1% by mass, with Sn as the balance. Another notable patent involves a method for manufacturing a solder joint part, which utilizes a specific alloy composition of Ni and Cu. This method leverages novel heating steps to ensure effective joining of different metal base materials, thereby enhancing the reliability of solder joints in various applications.
Career Highlights
Throughout his career, Tetsuro has worked with leading companies in the solder manufacturing sector, specifically with Nihon Superior Co., Ltd. and Nihon Superior Sha Co., Ltd. His commitment to innovation and quality has positioned him as a key contributor within these organizations, focusing on developing cutting-edge materials that meet industry standards while reducing environmental impact.
Collaborations
In his journey of innovation, Tetsuro Nishimura has collaborated with notable coworkers such as Kazuhiro Nogita and Stuart David McDonald. These partnerships have furthered the exploration and advancement of solder technologies, driving the development of robust, safe, and efficient materials.
Conclusion
Tetsuro Nishimura's contributions to solder technology illustrate the importance of innovation in creating sustainable solutions. His patents reflect a deep understanding of materials science and a commitment to advancing the field, making him a noteworthy inventor in the realm of lead-free solder alloys. As the industry moves towards greener alternatives, Nishimura's work will undoubtedly serve as a foundation for future advancements in solder technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile