The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Oct. 20, 2008
Applicant:
Tetsuro Nishimura, Osaka, JP;
Inventor:
Tetsuro Nishimura, Osaka, JP;
Assignee:
Nihon Superior Sha Co., Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C22C 13/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C22C 13/00 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); H05K 3/3457 (2013.01);
Abstract
A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.