The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2016
Filed:
Apr. 16, 2012
Applicant:
Tetsuro Nishimura, Osaka, JP;
Inventor:
Tetsuro Nishimura, Osaka, JP;
Assignee:
Nihon Superior Co., Ltd., Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/26 (2013.01); C22C 13/00 (2013.01); H05K 3/3463 (2013.01); Y10T 403/479 (2015.01);
Abstract
The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.