The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Oct. 31, 2019
Nihon Superior Co., Ltd., Osaka, JP;
The University of Queensland, Brisbane, AU;
Kazuhiro Nogita, Brisbane, AU;
Stuart David Mcdonald, Brisbane, AU;
Shiqian Liu, Brisbane, AU;
Tetsuro Nishimura, Suita, JP;
Takatoshi Nishimura, Tokyo, JP;
Tetsuya Akaiwa, Osaka, JP;
Nihon Superior Co., Ltd., Osaka, JP;
The University of Queensland, Brisbane, AU;
Abstract
In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGaor (Cu, Ni)Gabetween the first and second metal base materials, thereby joining the first and second metal material.