Nihon Superior Co., Ltd.

Nihon Superior Sha Co., Ltd.

The University of Queensland

Other

Takeda Chemical Industries, Inc.

Kyoto University

Nihon Kohden Corporation

Applied Nanoparticle Laboratory Corporation

Ns Tekuno Co., Ltd.

Tetsuro Nishimura

Takatoshi Nishimura

Tetsuya Akaiwa

Kazuhiro Nogita

Stuart David McDonald

Tsutomu Wakabayashi

Toshimi Shimizu

Teruo Komatsu

Kazuhiro Arita

Hideki Yoshida

Satoshi Hayashi

Taku Iwami

Shoichi Suenaga

Jonathan James Read

Tina Ventura

Takashi Nozu

Motonori Miyaoka

Mitsuhiro Kawahara

Masuml Asakawa

Kenichirou Todoroki

Toshihiro Hatakeyama

Yasufumi Shibata

Masuo Koshi

Yasuo Seo

Takayuki Otani

Yutaka Fukushima

Shiqian Liu

Tomoyoshi Natsui

Komatsu Teruo

Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu—Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu—Ni alloy, or contains Ni when the metal particle is formed of the Cu—Co alloy, and (Cu,Ni)6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.

Solder preform containing Cu—Co particles

A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.

Lead-free solder alloy

In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGaor (Cu, Ni)Gabetween the first and second metal base materials, thereby joining the first and second metal material.

Solder joint part and method for manufacturing the same

A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 mass % or more and 0.1 mass % or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.

Lead-free solder alloy and solder joint part

A light-emitting section () emits light to be irradiated on a body of a patient (). A light-receiving section () outputs a signal corresponding to an intensity of light which has been transmitted through or reflected from the body of the patient (). A pulse-amplitude Index acquiring section () analyzes amplitude of the signal to acquire a pulse-amplitude Index of the patient (). A pulse determining section () determines presence or absence of a pulse of the patient () in accordance with the pulse-amplitude Index. A notifying section () notifies a result of determination made by the pulse determining section ().

Lifesaving assisting apparatus

A nanoparticle production apparatus and automatic production apparatus that allow continuous mass production of nanoparticles with a uniform particle diameter and allow freely adjusting the generation time are provided. This nanoparticle production apparatus is characterized by being configured from: reaction tubes () which are filled with the same solvent () as that in a ingredient liquid (), which is used in nanoparticle production and comprises an ingredient material () mixed into the solvent (); a heating apparatus () which controls the temperature of the solvent () in the reaction tubes () to the synthesis temperature of the nanoparticles (); inflow ends () of the reaction tubes into which the ingredient liquid () is supplied; rotors () which form spiral flows (e, j) along the inner surface of the outer walls () of the reaction tubes while mixing the ingredient liquid () supplied and the solvent () present in the reaction tubes (); and outflow ends () of the reaction tubes () for forming, in the spiral flows (e, j), nanoparticles () from the ingredient material () and discharging a generation liquid () containing the nanoparticles ().

Nanoparticle production method, production device and automatic production device

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 &#x3bc;m or less.

Solder alloy and joint thereof

Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn&#x2014;Cu&#x2014;Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.

A solder alloy may include a Sn&#x2014;Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, AlO, or a combination thereof.

Solder alloy

A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.

Solder wire bobbinless coil

The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.

A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.

Solder joint

Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, 'skinned surface,' and 'rough and crumbling,' and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

Flux composition and soldering paste composition

A method by which the amount of nickel contained in an alloy having a composition represented by Sn&#x2014;X&#x2014;Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn&#x2014;X&#x2014;Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400&#xb0; C., and removing the resultant dross floating on the surface of the liquid phase and containing a P&#x2014;Ni compound and a P&#x2014;Sn&#x2014;Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt %. The phosphorus may be added in the state of a Sn&#x2014;P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

Method of regulating nickel concentration in lead-free solder containing nickel

A granulation method for granulating a (CuX)Sncompound by passing a composition comprising a (CuX)Sncompound and tin through a multi-perforated plate to granulate the (CuX)Sncompound wherein X represents an element which is solved in Cu but forms a precipitate with Sn.

Growing community of inventors

Osaka, Japan

Tetsuro Nishimura