The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2023
Filed:
Apr. 10, 2020
Applicant:
Nihon Superior Co., Ltd., Osaka, JP;
Inventor:
Tetsuro Nishimura, Osaka, JP;
Assignee:
NIHON SUPERIOR CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/02 (2006.01); B23K 35/26 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/02 (2013.01); B23K 2103/08 (2018.08);
Abstract
A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 mass % or more and 0.1 mass % or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.