The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Sep. 02, 2020
Applicant:
Nihon Superior Co., Ltd., Osaka, JP;
Inventor:
Tetsuro Nishimura, Osaka, JP;
Assignee:
NIHON SUPERIOR CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/30 (2006.01); C22C 9/06 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/302 (2013.01); C22C 9/06 (2013.01); B23K 2103/12 (2018.08);
Abstract
By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.