Osaka, Japan

Motonori Miyaoka

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Nihon Superior Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Motonori Miyaoka. Retrieved from https://idiyas.com/inventor/motonori-miyaoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovations of Motonori Miyaoka

Introduction

Motonori Miyaoka is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of solder alloys, particularly in enhancing joint strength through innovative materials.

Latest Patents

Miyaoka holds a patent for a solder alloy and joint thereof. This invention features a silver electrode joint that achieves high joint strength by minimizing the particle size of a silver-zinc intermetallic compound during solidification. The solder alloy comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese, with the balance consisting of tin. The resulting solder joint has a joint interface where the particle size of the silver-zinc intermetallic compound is 5 micrometers or less.

Career Highlights

Miyaoka is associated with Nihon Superior Co., Ltd., where he has been instrumental in developing advanced solder materials. His work has significantly impacted the electronics industry, particularly in improving the reliability of electronic connections.

Collaborations

Some of his notable coworkers include Tetsuro Nishimura and Shoichi Suenaga. Their collaborative efforts have contributed to the advancement of solder technology and its applications.

Conclusion

Motonori Miyaoka's innovative work in solder alloys exemplifies the importance of material science in modern technology. His contributions continue to influence the industry and enhance the performance of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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