For the Inventor, By the Inventor

Enter assignee name

Nexchip Semiconductor Corporation

USPTO Granted Patents = 13

Trademarks = 6

Forward Citations = 6

Loading Chart...

Loading Chart...

33 inventors (with patents filed for the assignee):

Ching-Ming Lee (3 out of 5 patents)

Geeng-Chuan Chern (2 out of 9 patents)

Menghui Wang (2 out of 2 patents)

4. Jinzhuan Zhu (2 out of 2 patents)

5. Chih-Hsien Huang (2 out of 2 patents)

6. Jian-Zhi Fang (2 out of 2 patents)

7. Hongbo Zhu (1 out of 2 patents)

8. Sun-Hung Chen (1 out of 1 patent)

9. Tsun-Min Cheng (1 out of 1 patent)

10. Jui-Min Lee (1 out of 1 patent)

11. Wei Xiang (1 out of 1 patent)

12. Renwei Zhu (1 out of 1 patent)

13. Yi Zhang (1 out of 11 patents)

14. Xiaodong Liu (1 out of 1 patent)

15. Chen-Hao Liu (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 12635486 - Semiconductor device and manufacturing method thereof (2026-05-19),

2. 12259661 - Overlay mark, overlay marking method and overlay measuring method (2025-03-25),

3. 12154972 - Diffused field-effect transistor (2024-11-26),

4. 11901217 - Method and apparatus for making shallow trench structure (2024-02-13),

5. 11876001 - Method and system for manufacturing semiconductor layer (2024-01-16),

6. 11069559 - Semiconductor structure and method of forming same (2021-07-20),

7. 11024722 - Diffused field-effect transistor and method of fabricating same (2021-06-01),

8. 10957776 - Method of fabricating MOSFET (2021-03-23),

9. 10950601 - Current source using emitter region as base region isolation structure (2021-03-16),

10. 10930545 - Method for forming semiconductor structure (2021-02-23),

11. 10916417 - Pre-processing method, method for forming metal silicide and semiconductor processing apparatus (2021-02-09),

12. 10490647 - Method of forming metal silicide layer, semiconductor device and method of fabricating same (2019-11-26),

13. 10490441 - Silicon island structure and method of fabricating same (2019-11-26),

Nexchip Semiconductor Corporation, headquartered in Hefei, China, specializes in the design and manufacture of advanced semiconductor solutions. The company focuses on developing innovative technologies for various applications, including consumer electronics, automotive systems, and industrial automation. With a commitment to research and development, Nexchip aims to enhance performance and efficiency in semiconductor products, positioning itself as a key player in the global semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

13 Patents

#26 in Hefei

#2,186 in China

#44,988 in the World

Nexchip Semiconductor Corporation

Forward Citations = 6

33 inventors:

Ching-Ming Lee (3 out of 5 patents)

Geeng-Chuan Chern (2 out of 9 patents)

Menghui Wang (2 out of 2 patents)

4. Jinzhuan Zhu (2 out of 2 patents)

5. Chih-Hsien Huang (2 out of 2 patents)

Please report any incorrect information to [email protected]

Loading…