The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Apr. 30, 2021
Applicant:

Nexchip Semiconductor Corporation, Anhui, CN;

Inventors:

Tzujen Lin, Anhui, CN;

Chihchiang Yang, Anhui, CN;

Chengwei Lin, Anhui, CN;

Yucheng Lin, Anhui, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/32137 (2013.01);
Abstract

The present disclosure provides a method for making a shallow trench structure, which at least includes the following: preparing a substrate; forming a first material layer on one side of the substrate; forming a second material layer on the first material layer; forming a shallow trench in the second material layer, the first material layer and the substrate; performing a first lateral etching on the second material layer from the shallow trench to both sides by using wet etching; performing a second lateral etching on the first material layer from the shallow trench to both sides by using dry etching. The present disclosure solves the problem of the damage to the silicon in the shallow trench caused by the traditional lateral etching technology.


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