For the Inventor, By the Inventor

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San Jose, CA, United States of America

Nanonexus Corporation

USPTO Granted Patents = 19

Forward Citations = 826

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19 inventors (with patents filed for the assignee):

Fu Chiung Chong (18 out of 24 patents)

Sammy Mok (17 out of 23 patents)

Frank Swiatowiec (4 out of 8 patents)

4. Roman Milter (4 out of 4 patents)

5. Joseph Michael Haemer (4 out of 4 patents)

6. Syamal Kumar Lahiri (3 out of 6 patents)

7. Douglas N Modlin (3 out of 46 patents)

8. Erh-Kong Chieh (2 out of 4 patents)

9. David Doan (2 out of 3 patents)

10. Chang-Ming Lin (2 out of 5 patents)

11. Yi-Hsing Chen (2 out of 2 patents)

12. Nitin S Parekh (1 out of 11 patents)

13. Douglas J McKay (1 out of 4 patents)

14. Andrew Kao (1 out of 3 patents)

15. Anna Litza (1 out of 3 patents)

19 patents: Sort by Forward Citations

1. 7772860 - Massively parallel interface for electronic circuit (2010-08-10),

2. 7621761 - Systems for testing and packaging integrated circuits (2009-11-24),

3. 7579848 - High density interconnect system for IC packages and interconnect assemblies (2009-08-25),

4. 7403029 - Massively parallel interface for electronic circuit (2008-07-22),

5. 7382142 - High density interconnect system having rapid fabrication cycle (2008-06-03),

6. 7349223 - Enhanced compliant probe card systems having improved planarity (2008-03-25),

7. 7247035 - Enhanced stress metal spring contactor (2007-07-24),

8. 7153399 - Method and apparatus for producing uniform isotropic stresses in a sputtered film (2006-12-26),

9. 7138818 - Massively parallel interface for electronic circuit (2006-11-21),

10. 7137830 - Miniaturized contact spring (2006-11-21),

11. 7126358 - Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies (2006-10-24),

12. 7126220 - Miniaturized contact spring (2006-10-24),

13. 7009412 - Massively parallel interface for electronic circuit (2006-03-07),

14. 6917525 - Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs (2005-07-12),

15. 6815961 - Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies (2004-11-09),

Nanonexus Corporation is a leading technology company specializing in nanotechnology research, development, and manufacturing. With a focus on innovation and cutting-edge solutions, Nanonexus has revolutionized various industries such as electronics, healthcare, and energy. Through strategic partnerships and a dedicated team of scientists and engineers, Nanonexus continues to push the boundaries of what is possible in the nanotechnology field.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

19 Patents

#332 in San Jose, CA

#3,964 in California

#16,592 in US

#31,670 in the World

San Jose, CA, United States of America

Nanonexus Corporation

Forward Citations = 826

19 inventors:

Fu Chiung Chong (18 out of 24 patents)

Sammy Mok (17 out of 23 patents)

Frank Swiatowiec (4 out of 8 patents)

4. Roman Milter (4 out of 4 patents)

5. Joseph Michael Haemer (4 out of 4 patents)

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