The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Mar. 17, 2003
Syamal Kumar Lahiri, Milpitas, CA (US);
Frank Swiatowiec, San Jose, CA (US);
Fu Chiung Chong, Saratoga, CA (US);
Sammy Mok, Cupertino, CA (US);
Erh-kong Chieh, Cupertino, CA (US);
Roman L. Milter, San Francisco, CA (US);
Joseph M. Haemer, San Jose, CA (US);
Chang-ming Lin, San Jose, CA (US);
Yi-hsing Chen, San Jose, CA (US);
David Thanh Doan, San Jose, CA (US);
Syamal Kumar Lahiri, Milpitas, CA (US);
Frank Swiatowiec, San Jose, CA (US);
Fu Chiung Chong, Saratoga, CA (US);
Sammy Mok, Cupertino, CA (US);
Erh-Kong Chieh, Cupertino, CA (US);
Roman L. Milter, San Francisco, CA (US);
Joseph M. Haemer, San Jose, CA (US);
Chang-Ming Lin, San Jose, CA (US);
Yi-Hsing Chen, San Jose, CA (US);
David Thanh Doan, San Jose, CA (US);
NanoNexus, Inc., San Jose, CA (US);
Abstract
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.