Sammy Mok

This inventor holds 23 USPTO granted patents, primarily in Integrated Circuit Testing. Top assignees: Nanonexus Corporation, Verigy (Singapore) Pte. Ltd., Innoconnex, Inc.. Active years: 2004-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sammy Mok. Retrieved from https://idiyas.com/inventor/sammy-mok

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 4.3

Average Co-Inventor Count = 2.9

ph-index = 13

Forward Citations = 800(Granted Patents)

Company Filing History:

17 out of 19

Nanonexus Corporation

patents

4 out of 115

Verigy (Singapore) Pte. Ltd.

Years Active: 2004-2013

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Areas of Expertise:

Probe Card Assembly

High Density Interconnect

Integrated Circuit

Testing Systems

Manufacturing Processes

Massively Parallel Interface

Electronic Circuit

Spring Contacts

Wafer Level Springs

Contact Spring

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8531202 - Probe card test apparatus and method (2013-09-10),

2. 7952373 - Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies (2011-05-31),

3. 7884634 - High density interconnect system having rapid fabrication cycle (2011-02-08),

4. 7876087 - Probe card repair using coupons with spring contacts and separate atachment points (2011-01-25),

5. 7872482 - High density interconnect system having rapid fabrication cycle (2011-01-18),

6. 7812626 - High density interconnect system for IC packages and interconnect assemblies (2010-10-12),

7. 7772860 - Massively parallel interface for electronic circuit (2010-08-10),

8. 7621761 - Systems for testing and packaging integrated circuits (2009-11-24),

9. 7579848 - High density interconnect system for IC packages and interconnect assemblies (2009-08-25),

10. 7403029 - Massively parallel interface for electronic circuit (2008-07-22),

11. 7382142 - High density interconnect system having rapid fabrication cycle (2008-06-03),

12. 7247035 - Enhanced stress metal spring contactor (2007-07-24),

13. 7138818 - Massively parallel interface for electronic circuit (2006-11-21),

14. 7137830 - Miniaturized contact spring (2006-11-21),

15. 7126358 - Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies (2006-10-24),

Title: The Innovative Journey of Sammy Mok

Introduction: Sammy Mok, a talented inventor based in Cupertino, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Sammy Mok holds several patents in the areas of artificial intelligence, machine learning, and consumer electronics. His most recent patent involves a revolutionary method for enhancing user experience in smart home devices.

Career Highlights: With a background in computer science and engineering, Sammy Mok has worked for top tech companies in Silicon Valley, where he honed his skills in developing cutting-edge technologies. His innovative solutions have garnered recognition in the industry.

Collaborations: Throughout his career, Sammy Mok has collaborated with leading researchers and engineers to push the boundaries of technological advancements. His collaborative efforts have resulted in the development of groundbreaking products that have transformed the way we interact with technology.

Conclusion: Sammy Mok's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to drive him towards creating solutions that shape the future of the tech industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]