Company Filing History:
Years Active: 2008-2011
Title: The Innovative Contributions of Andrew Kao
Introduction
Andrew Kao is a notable inventor based in Fremont, California, recognized for his significant contributions to the field of interconnection systems. With a total of three patents to his name, Kao has demonstrated a commitment to advancing technology in semiconductor applications.
Latest Patents
One of Andrew Kao's latest patents is titled "High Density Interconnect System Having Rapid Fabrication Cycle." This patent describes an improved interconnection system and method applicable to connectors, socket assemblies, and probe card systems. The exemplary system includes a probe card interface assembly (PCIA) designed to establish electrical connections to a semiconductor wafer mounted in a prober. The PCIA features a motherboard that is parallel to the semiconductor wafer, with a reference plane defined by at least three points located between the lower surface of the motherboard and the wafer. Additionally, it includes at least one component located below the motherboard mounting surface and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip with multiple spring probes can be mounted and demounted from the PCIA without requiring further planarity adjustment. The interconnection structures and methods outlined in this patent aim to provide improved fabrication cycles.
Career Highlights
Throughout his career, Andrew Kao has worked with several prominent companies, including Verigy Pte. Ltd. and Nanonexus Corporation. His experience in these organizations has contributed to his expertise in the field of semiconductor technology and interconnection systems.
Collaborations
Andrew Kao has collaborated with notable professionals in his field, including Fu Chiung Chong and Douglas J McKay. These collaborations have likely enriched his work and contributed to the development of innovative solutions in interconnection technology.
Conclusion
In summary, Andrew Kao is an accomplished inventor whose work in high-density interconnect systems has made a significant impact on semiconductor technology. His patents reflect a dedication to improving fabrication cycles and enhancing electrical connections in advanced applications.