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Gyeonggi, South Korea

K. C. Tech Co., Ltd.

USPTO Granted Patents = 60

% Expired Patents = 1.7

Forward Citations = 138

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158 inventors (with patents filed for the assignee):

Jun Ha Hwang (8 out of 9 patents)

Jung Yoon Kim (5 out of 17 patents)

Kwang Soo Park (4 out of 41 patents)

4. Sung Pyo Lee (4 out of 5 patents)

5. Hyun Goo Kong (4 out of 5 patents)

6. Jang Kuk Kwon (4 out of 4 patents)

7. Chang Gil Kwon (4 out of 4 patents)

8. Jun Ho Son (4 out of 8 patents)

9. Cheol-Nam Yoon (4 out of 4 patents)

10. Yong Kim (4 out of 13 patents)

11. Soo Wan Choi (3 out of 3 patents)

12. Hyung Chul Kim (3 out of 33 patents)

13. Nak Hyun Choi (3 out of 3 patents)

14. Jin Sook Hwang (3 out of 5 patents)

15. Seok Min Hong (3 out of 3 patents)

Core Competencies:

Chemical Mechanical Polishing

Slurry Composition

Substrate Processing

Abrasive Particles

Cleaning Methods

Semiconductor Devices

Polishing Systems

CMP Equipment

Surface Cleaning

Integrated Circuit Device

Polishing Apparatus

Temperature Detection

60 patents: Sort by Forward Citations

1. 12503622 - Cerium-based particle and polishing slurry composition including the same (2025-12-23),

2. 12472532 - Substrate treating apparatus and cleaning nozzle used therein (2025-11-18),

3. 12451370 - Substrate processing system with vertical arrangement structure (2025-10-21),

4. 12448542 - Slurry composition for polishing organic film (2025-10-21),

5. 12428584 - Cerium oxide abrasive particles and polishing slurry composition (2025-09-30),

6. 12421424 - Slurry composition and method of manufacturing integrated circuit device by using the same (2025-09-23),

7. 12394627 - Substrate polishing system (2025-08-19),

8. 12305079 - CMP slurry composition for polishing polycrystalline silicon and polishing method using same (2025-05-20),

9. 12247141 - Polishing slurry composition (2025-03-11),

10. 12187919 - Polishing slurry composition (2025-01-07),

11. 12186900 - Substrate cleaning line and substrate cleaning system comprising the same (2025-01-07),

12. 12091636 - Composition for dissolving abrasive particles and cleaning method using the same (2024-09-17),

13. 12037516 - Polishing slurry composition and method for producing same (2024-07-16),

14. 12031062 - Polishing slurry composition for sti process (2024-07-09),

15. 11919122 - Polishing head, substrate processing apparatus including the same and processing method of substrate using the same (2024-03-05),

Company Overview

K. C. Tech Co., Ltd. is a prominent player in the field of Chemical Mechanical Polishing (CMP), specializing in the development and manufacturing of advanced polishing systems and equipment. The company focuses on innovative slurry compositions and substrate processing techniques, catering primarily to the semiconductor industry. With a strong emphasis on abrasive particles and effective cleaning methods, K. C. Tech aims to enhance the efficiency and quality of semiconductor device fabrication, positioning itself as a key contributor in the technology landscape of Gyeonggi, South Korea.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

60 Patents

#1 in Gyeonggi

#284 in South Korea

#12,094 in the World

Gyeonggi, South Korea

K. C. Tech Co., Ltd.

Forward Citations = 138

158 inventors:

Jun Ha Hwang (8 out of 9 patents)

Jung Yoon Kim (5 out of 17 patents)

Kwang Soo Park (4 out of 41 patents)

4. Sung Pyo Lee (4 out of 5 patents)

5. Hyun Goo Kong (4 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: K. C. Tech Co., Ltd.. Retrieved from https://idiyas.com/company/k-c-tech-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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