The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Jan. 18, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Wooin Lee, Hwaseong-si, KR;
Jihye Kim, Anseong-si, KR;
Seungho Park, Seoul, KR;
Jaewoo Lee, Anseong-si, KR;
Jaeik Lee, Anseong-si, KR;
Jaehak Lee, Anseong-si, KR;
Bohyeok Choi, Anseong-si, KR;
Jungeun Kang, Seoul, KR;
Boyun Kim, Hwaseong-si, KR;
Sangkyun Kim, Hwaseong-si, KR;
Hyukmin Kim, Yongin-si, KR;
Abstract
A slurry composition is used to treat a surface of a target structure including at least one of a first polishing target film and a second polishing target film, which include different materials from each other, by a chemical mechanical polishing (CMP) process. The slurry composition includes: polishing particles; a first inhibitor including a nonionic polymer to selectively bond to the first polishing target film; and a second inhibitor including an anionic polymer to selectively bond to the second polishing target film. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a target structure including at least one of a first polishing target film and a second polishing target film; applying the slurry composition onto the target structure; and treating a surface of the target structure by a CMP process while the slurry composition covers the target structure.