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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11919122 B1

PDFFull Text
Date of Patent:
Mar. 05, 2024

Filed:

Sep. 29, 2020

Polishing head, substrate processing apparatus including the same and processing method of substrate using the same

Applicants:

Samsung Display Co., Ltd., Yongin-si, KR;

Kctech Co., Ltd., Anseong-si, KR;

Inventors:

Seung Bae Kang, Suwon-si, KR;

Sung Hyeon Park, Anseong-si, KR;

Jung Gun Nam, Suwon-si, KR;

Joon-Hwa Bae, Suwon-si, KR;

Kyung Bo Lee, Anseong-si, KR;

Keun Woo Lee, Anseong-si, KR;

Woo Jin Cho, Yongin-si, KR;

Byoung Kwon Choo, Hwaseong-si, KR;

Assignees:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

KCTECH CO., LTD., Gyeonggi-Do, KR;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

Laura C Guidotti

Assistant Examiner:

Sukwoo James Chang

Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/04 (2012.01); C03C 19/00 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H10K 59/121 (2023.01); H10K 71/00 (2023.01); H10K 71/20 (2023.01); H10K 71/70 (2023.01); H10K 77/10 (2023.01); H01L 29/768 (2006.01); H01L 29/786 (2006.01); H10K 59/12 (2023.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/042 (2013.01); C03C 19/00 (2013.01); H10K 59/1213 (2023.02); H10K 71/00 (2023.02); H10K 71/20 (2023.02); H10K 71/70 (2023.02); H10K 77/10 (2023.02); H01L 27/1218 (2013.01); H01L 27/1222 (2013.01); H01L 27/1262 (2013.01); H01L 27/1274 (2013.01); H01L 29/6675 (2013.01); H01L 29/78672 (2013.01); H10K 59/1201 (2023.02);
Abstract

A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

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