For the Inventor, By the Inventor

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Jiangyin, China

Jcet Group Co., Ltd.

USPTO Granted Patents = 7

Forward Citations = 0

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21 inventors (with patents filed for the assignee):

Shuo Liu (5 out of 12 patents)

Danfeng Yang (4 out of 9 patents)

Yaojian Lin (4 out of 14 patents)

4. Chenye He (3 out of 6 patents)

5. Shasha Zhou (3 out of 3 patents)

6. Chen Xu (2 out of 2 patents)

7. Xueqing Chen (2 out of 2 patents)

8. Cheng Yang (1 out of 6 patents)

9. Wei Yan (1 out of 4 patents)

10. Yuesheng Zhang (1 out of 1 patent)

11. Ting Liu (1 out of 1 patent)

12. Rong Fan (1 out of 1 patent)

13. Li Zou (1 out of 1 patent)

14. YaoJian Lin (1 out of 1 patent)

15. Jianyong Wu (1 out of 1 patent)

7 patents: Sort by Forward Citations

1. 12713929 - FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF (2026-08-18),

2. 12616057 - Double-sided sip packaging structure having interposer including a groove and manufacturing method thereof (2026-04-28),

3. 12593731 - Packaging structure and manufacturing method thereof (2026-03-31),

4. 12581965 - Packaging structure and manufacturing method thereof (2026-03-17),

5. 12575447 - QFN packaging structure and QFN packaging method (2026-03-10),

6. 12562772 - Magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips (2026-02-24),

7. 12550261 - Package structure with inductor, and manufacturing method thereof (2026-02-10),

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USPTO Data Jan 1 1976 - Sep 22 2026

7 Patents

#4 in Jiangyin

#3,875 in China

Jiangyin, China

Jcet Group Co., Ltd.

Forward Citations = 0

21 inventors:

Shuo Liu (5 out of 12 patents)

Danfeng Yang (4 out of 9 patents)

Yaojian Lin (4 out of 14 patents)

4. Chenye He (3 out of 6 patents)

5. Shasha Zhou (3 out of 3 patents)

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