Jianyong Wu

Title: Jianyong Wu: Innovator in Double-Sided SiP Packaging Technology

Introduction

Jianyong Wu is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of packaging technology, particularly in the development of double-sided System in Package (SiP) structures. His innovative approach has led to advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

Jianyong Wu holds a patent for a "Double-sided SiP packaging structure having interposer including a groove and manufacturing method thereof." This patent describes a double-sided SiP packaging structure that includes a substrate, a first packaging structure on the substrate, and a second packaging structure located below the substrate. The second packaging structure consists of a chip, an interposer, and a molding material. A conductive structure array is positioned on the upper surface of the interposer, which is arranged below the substrate through this conductive structure array. The space between the lower surface of the substrate, the chip, and the interposer is filled with molding material. Additionally, a conductive bonding pad array is located on the lower surface of the interposer, with a groove formed in a specific region between the conductive bonding pad and the edge contour of the interposer. This innovative design aims to improve the performance and reliability of electronic packaging.

Career Highlights

Jianyong Wu is associated with Jcet Group Co., Ltd., a company known for its advancements in semiconductor packaging technology. His work at Jcet Group has allowed him to focus on innovative solutions that address the challenges in the electronics industry. His expertise in packaging structures has positioned him as a key player in the field.

Collaborations

Jianyong Wu collaborates with YaoJian Lin, who is also involved in the development of advanced packaging technologies. Their partnership has fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jianyong Wu's contributions to double-sided SiP packaging technology exemplify the importance of innovation in the electronics sector. His patent and ongoing work at Jcet Group Co., Ltd. highlight his commitment to advancing packaging solutions that meet the demands of modern technology.