This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Jcet Group Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: YaoJian Lin: Innovator in Double-Sided SiP Packaging Technology
Introduction
YaoJian Lin is a prominent inventor based in Jiangsu, China. He has made significant contributions to the field of packaging technology, particularly in the development of innovative structures that enhance the performance and efficiency of electronic devices. His work is characterized by a focus on double-sided System in Package (SiP) solutions.
Latest Patents
YaoJian Lin holds a patent for a "Double-sided SiP packaging structure having interposer including a groove and manufacturing method thereof." This patent describes a unique double-sided SiP packaging structure that includes a substrate, a first packaging structure on the substrate, and a second packaging structure located below it. The second packaging structure consists of a chip, an interposer, and a molding material. The design features a conductive structure array on the upper surface of the interposer, which is positioned below the substrate. The space between the substrate, chip, and interposer is filled with molding material, and a groove is formed between the conductive bonding pad and the edge contour of the interposer.
Career Highlights
YaoJian Lin is associated with Jcet Group Co., Ltd., where he has been instrumental in advancing packaging technologies. His innovative approach has led to the development of solutions that address the growing demands of the electronics industry. His expertise in SiP technology has positioned him as a key figure in this specialized field.
Collaborations
YaoJian Lin collaborates with fellow inventor Jianyong Wu, contributing to the advancement of their shared goals in packaging technology. Their partnership has fostered a creative environment that encourages innovation and the development of cutting-edge solutions.
Conclusion
YaoJian Lin's contributions to double-sided SiP packaging technology exemplify his commitment to innovation in the electronics sector. His patent and collaborative efforts highlight the importance of advanced packaging solutions in modern technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile