Chenye He

Title: Chenye He: Innovator in Antenna Packaging Technology

Introduction

Chenye He is a prominent inventor based in Wuxi, China. He has made significant contributions to the field of antenna packaging technology, holding a total of 3 patents. His innovative work focuses on improving the efficiency and effectiveness of antenna structures.

Latest Patents

Chenye He's latest patents include an "Antenna packaging structure and manufacturing method thereof." This invention provides a unique antenna packaging structure where an antenna and a chip are positioned on opposite sides of a substrate layer. The design incorporates low dielectric loss materials, which help to minimize issues such as current leakage and stray capacitance, ultimately reducing the size of the antenna packaging structure.

Another notable patent is for a "Package structure having a plurality of chips attached to a lead frame by redistribution layer." This invention outlines a package structure that enhances heat dissipation capacity through a fan-out package structure formed on a metal lead frame. The design includes multiple electrical elements and a second reconstruction layer, which improves the overall functionality of the package.

Career Highlights

Chenye He is associated with Jcet Group Co., Ltd., where he continues to develop innovative solutions in the field of electronics. His work has garnered attention for its practical applications and advancements in technology.

Collaborations

Chenye has collaborated with notable coworkers, including Yaojian Lin and Shuo Liu, contributing to various projects that enhance the capabilities of antenna packaging.

Conclusion

Chenye He stands out as a key figure in the realm of antenna packaging technology. His patents reflect a commitment to innovation and improvement in electronic design. His contributions are paving the way for advancements in the industry.