The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Dec. 07, 2022
Jcet Group Co., Ltd., Wuxi City, CN;
Yaojian Lin, Wuxi City, CN;
Chen Xu, Wuxi City, CN;
Shuo Liu, Wuxi City, CN;
Danfeng Yang, Wuxi City, CN;
Shasha Zhou, Wuxi City, CN;
Xueqing Chen, Wuxi City, CN;
Chenye He, Wuxi City, CN;
JCET GROUP CO., LTD., Wuxi City, CN;
Abstract
The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is disposed between the lower package and the upper package and is electrically connected to the lower package and the upper package. The lower package includes a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer. A minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.