The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Aug. 12, 2022
Applicant:
Jcet Group Co., Ltd., Wuxi City, CN;
Inventors:
Yun Gao, Wuxi City, CN;
Ting Liu, Wuxi City, CN;
Yuesheng Zhang, Wuxi City, CN;
Rong Fan, Wuxi City, CN;
Assignee:
JCET GROUP CO., LTD., Wuxi City, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/08 (2006.01); H01L 21/4757 (2006.01); H01L 23/053 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/08 (2013.01); H01L 21/47573 (2013.01); H01L 23/053 (2013.01); H01L 23/552 (2013.01);
Abstract
The present invention provides a QFN packaging structure and QFN packaging method. By providing the insulating layer on the outer side of the leads of the QFN packaging structure, a short circuit between the leads and the electromagnetic shielding layer can be prevented. In addition, the grounding lead is exposed from the insulating layer, such that the electromagnetic shielding layer is grounded via the grounding lead, thereby realizing the electromagnetic shielding design of the QFN packaging structure.