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Hd Microsystems, Ltd.

USPTO Granted Patents = 10

EPO Patents = 2

Trademarks = 2

Forward Citations = 2

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19 inventors (with patents filed for the assignee):

Tetsuya Enomoto (5 out of 6 patents)

Daisaku Matsukawa (4 out of 4 patents)

Nobuyuki Saito (3 out of 3 patents)

4. Tadamitsu Nakamura (3 out of 3 patents)

5. Yukari Koibuchi (2 out of 2 patents)

6. Atsutaro Yoshizawa (2 out of 2 patents)

7. Akira Asada (2 out of 2 patents)

8. Satoshi Yoneda (2 out of 2 patents)

9. Takashi Kawamori (1 out of 9 patents)

10. Yutaka Namatame (1 out of 1 patent)

11. Ayaka Azuma (1 out of 1 patent)

12. Kazuya Soejima (1 out of 1 patent)

13. Satoshi Abe (1 out of 1 patent)

14. Masato Nishimura (1 out of 10 patents)

15. Etsuharu Tsuchiya (1 out of 1 patent)

10 patents: Sort by Forward Citations

1. 12601970 - Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component (2026-04-14),

2. 12386257 - Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component (2025-08-12),

3. 12386256 - Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component (2025-08-12),

4. 11807721 - Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component (2023-11-07),

5. 11592744 - Positive-type photosensitive resin composition (2023-02-28),

6. 11592743 - Positive-type photosensitive resin composition (2023-02-28),

7. 11487201 - Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component (2022-11-01),

8. 11226560 - Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component (2022-01-18),

9. 11048167 - Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component (2021-06-29),

10. 11021572 - Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component (2021-06-01),

Company Overview

Hd Microsystems, Ltd. is a Tokyo-based company specializing in advanced semiconductor solutions and integrated circuit design. The organization focuses on developing innovative technologies for various applications, including consumer electronics, automotive systems, and industrial automation. With a commitment to research and development, Hd Microsystems aims to enhance performance and efficiency in electronic devices, contributing to the evolution of smart technologies in a rapidly changing digital landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

10 Patents

#1,914 in Tokyo

#4,401 in Japan

#56,047 in the World

Hd Microsystems, Ltd.

Forward Citations = 2

19 inventors:

Tetsuya Enomoto (5 out of 6 patents)

Daisaku Matsukawa (4 out of 4 patents)

Nobuyuki Saito (3 out of 3 patents)

4. Tadamitsu Nakamura (3 out of 3 patents)

5. Yukari Koibuchi (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hd Microsystems, Ltd.. Retrieved from https://idiyas.com/company/hd-microsystems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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