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Hd Microsystems, Ltd.

USPTO Granted Patents = 9

EPO Patents = 2

Trademarks = 2

Forward Citations = 2

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17 inventors (with patents filed for the assignee):

Tetsuya Enomoto (5 out of 5 patents)

Nobuyuki Saito (3 out of 3 patents)

Daisaku Matsukawa (3 out of 3 patents)

4. Tadamitsu Nakamura (3 out of 3 patents)

5. Yukari Koibuchi (2 out of 2 patents)

6. Atsutaro Yoshizawa (2 out of 2 patents)

7. Akira Asada (2 out of 2 patents)

8. Satoshi Yoneda (2 out of 2 patents)

9. Takashi Kawamori (1 out of 7 patents)

10. Yutaka Namatame (1 out of 1 patent)

11. Ayaka Azuma (1 out of 1 patent)

12. Kazuya Soejima (1 out of 1 patent)

13. Satoshi Abe (1 out of 1 patent)

14. Masato Nishimura (1 out of 10 patents)

15. Etsuharu Tsuchiya (1 out of 1 patent)

9 patents: Sort by Forward Citations

1. 12386257 - Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component (2025-08-12),

2. 12386256 - Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component (2025-08-12),

3. 11807721 - Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component (2023-11-07),

4. 11592744 - Positive-type photosensitive resin composition (2023-02-28),

5. 11592743 - Positive-type photosensitive resin composition (2023-02-28),

6. 11487201 - Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component (2022-11-01),

7. 11226560 - Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component (2022-01-18),

8. 11048167 - Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component (2021-06-29),

9. 11021572 - Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component (2021-06-01),

Hd Microsystems, Ltd. is a cutting-edge technology company specializing in advanced microprocessor development and innovative solutions for various industries. With a strong focus on research and development, we strive to deliver high-performance products that meet the demands of our customers. Our team of experts is dedicated to pushing the boundaries of technology and creating solutions that drive success for our clients.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

9 Patents

#1,786 in Tokyo

#4,572 in Japan

Hd Microsystems, Ltd.

Forward Citations = 2

17 inventors:

Tetsuya Enomoto (5 out of 5 patents)

Nobuyuki Saito (3 out of 3 patents)

Daisaku Matsukawa (3 out of 3 patents)

4. Tadamitsu Nakamura (3 out of 3 patents)

5. Yukari Koibuchi (2 out of 2 patents)

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