The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2021
Filed:
Jan. 22, 2016
Applicant:
Hitachi Chemical Dupont Microsystems, Ltd., Tokyo, JP;
Inventors:
Daisaku Matsukawa, Tokyo, JP;
Tetsuya Enomoto, Tokyo, JP;
Assignee:
HD MICROSYSTEMS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); G03F 7/40 (2006.01); G03F 7/022 (2006.01); C09D 179/04 (2006.01); C08G 69/32 (2006.01); C08G 73/22 (2006.01); C08K 5/03 (2006.01); C08K 5/42 (2006.01); C08L 75/04 (2006.01); C08G 71/04 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0226 (2013.01); C08G 69/32 (2013.01); C08G 73/22 (2013.01); C08K 5/03 (2013.01); C08K 5/42 (2013.01); C08L 75/04 (2013.01); C09D 179/04 (2013.01); G03F 7/023 (2013.01); G03F 7/0233 (2013.01); G03F 7/40 (2013.01); C08G 71/04 (2013.01);
Abstract
A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
Matsukawa, Daisaku. (2021). Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component (U.S. Patent No. 11048167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11048167
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile