The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Jun. 17, 2019
Applicant:

Hd Microsystems, Ltd., Tokyo, JP;

Inventors:

Hiroko Yotsuyanagi, Hitachi, JP;

Daisaku Matsukawa, Hitachi, JP;

Noriyuki Yamazaki, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/037 (2006.01); G03F 7/031 (2006.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); G03F 7/031 (2013.01);
Abstract

A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; and (D) an ultraviolet absorber.


Find Patent Forward Citations

Yotsuyanagi, Hiroko. (2026). Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component (U.S. Patent No. 12601970). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12601970

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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