For the Inventor, By the Inventor

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Eastlake, OH, United States of America

Gould Electronics Inc.

USPTO Granted Patents = 65

% Expired Patents = 3.1

CIPO Patents = 1

Trademarks = 2

Forward Citations = 1,139

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89 inventors (with patents filed for the assignee):

Thomas J Ameen (10 out of 15 patents)

Peter Peckham (8 out of 16 patents)

Adam G Bay (7 out of 15 patents)

4. Ronald K Haines (7 out of 11 patents)

5. Charles A Poutasse (6 out of 11 patents)

6. Sidney J Clouser (6 out of 20 patents)

7. Shiuh-Kao Chiang (5 out of 9 patents)

8. Robert D DeWitt (5 out of 9 patents)

9. Mary P Rossoll (5 out of 8 patents)

10. Jiangtao Wang (4 out of 9 patents)

11. Chin-Ho Lee (4 out of 7 patents)

12. Jerry L Mosesian (3 out of 17 patents)

13. Dino F DiFranco (3 out of 10 patents)

14. Dan Lillie (3 out of 5 patents)

15. John P Callahan (3 out of 6 patents)

Core Competencies:

Copper Foil

Flexible Circuits

Multilayer Laminates

Adhesion Enhancement

Optical Fiber

Resistor Components

Lithium-Ion Batteries

Electrodeposition

Circuit Protection

Epoxy Adhesives

Metal Foil

Polymeric Films

65 patents: Sort by Forward Citations

1. 6622374 - Resistor component with multiple layers of resistive material (2003-09-23),

2. 6589413 - Method of making a copper on INVAR® composite (2003-07-08),

3. 6589381 - Coatings for improved resin dust resistance (2003-07-08),

4. 6489035 - Applying resistive layer onto copper (2002-12-03),

5. 6489034 - Method of forming chromium coated copper for printed circuit boards (2002-12-03),

6. 6447929 - Thin copper on usable carrier and method of forming same (2002-09-10),

7. 6376008 - Resin/copper/metal laminate and method of producing same (2002-04-23),

8. 6268070 - Laminate for multi-layer printed circuit (2001-07-31),

9. 6224722 - Method and apparatus for sequentially metalizing polymeric films and products made thereby (2001-05-01),

10. 6221176 - Surface treatment of copper to prevent microcracking in flexible circuits (2001-04-24),

11. 6171714 - Adhesiveless flexible laminate and process for making adhesiveless flexible laminate (2001-01-09),

12. 6132887 - High fatigue ductility electrodeposited copper foil (2000-10-17),

13. 6086743 - Adhesion enhancement for metal foil (2000-07-11),

14. 6042711 - Metal foil with improved peel strength and method for making said foil (2000-03-28),

15. 5969928 - Shunt for circuit protection device (1999-10-19),

Gould Electronics Inc. is a leading global provider of innovative electronic solutions. With over three decades of experience, we specialize in designing, manufacturing, and distributing a wide range of high-quality electronic components. Our commitment to exceptional quality, unmatched reliability, and customer satisfaction has made us a trusted partner for businesses worldwide. Visit our website to explore our extensive product portfolio and learn more about how we can help meet your electronic needs.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

65 Patents

#1 in Eastlake, OH

#251 in Ohio

#5,600 in US

#11,305 in the World

Eastlake, OH, United States of America

Gould Electronics Inc.

Forward Citations = 1,139

89 inventors:

Thomas J Ameen (10 out of 15 patents)

Peter Peckham (8 out of 16 patents)

Adam G Bay (7 out of 15 patents)

4. Ronald K Haines (7 out of 11 patents)

5. Charles A Poutasse (6 out of 11 patents)

Please report any incorrect information to [email protected]

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