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For the Inventor, By the Inventor

Eastlake, OH, United States of America

Gould Electronics Inc.


USPTO Granted Patents = 65


Trademarks = 6

Forward Citations = 1,116

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89 inventors (with patents filed for the assignee):

goldMedal Thomas J Ameen (10 out of 15 patents)

silverMedal Peter Peckham (8 out of 16 patents)

bronzeMedal Adam G Bay (7 out of 15 patents)

4.  Ronald K Haines (7 out of 11 patents)

5.  Charles A Poutasse (6 out of 11 patents)

6.  Sidney J Clouser (6 out of 20 patents)

7.  Shiuh-Kao Chiang (5 out of 9 patents)

8.  Robert D DeWitt (5 out of 9 patents)

9.  Mary P Rossoll (5 out of 8 patents)

10.  Jiangtao Wang (4 out of 9 patents)

11.  Chin-Ho Lee (4 out of 7 patents)

12.  Jerry L Mosesian (3 out of 17 patents)

13.  Dino F DiFranco (3 out of 10 patents)

14.  Dan Lillie (3 out of 5 patents)

15.  John P Callahan (3 out of 6 patents)


Core Competencies:
Resistor Component
Copper Foil
Flexible Laminate
Optical Fiber Coupler
Electrodeposited Copper
Metal Foil
Lithium-Ion Battery
Polymeric Films
Adhesion Enhancement
Circuit Protection Device
Copper Metal Powder
High Performance Adhesives

65 patents:

1. 6622374 - Resistor component with multiple layers of resistive material (2003-09-23),
2. 6589413 - Method of making a copper on INVAR® composite (2003-07-08),
3. 6589381 - Coatings for improved resin dust resistance (2003-07-08),
4. 6489035 - Applying resistive layer onto copper (2002-12-03),
5. 6489034 - Method of forming chromium coated copper for printed circuit boards (2002-12-03),
6. 6447929 - Thin copper on usable carrier and method of forming same (2002-09-10),
7. 6376008 - Resin/copper/metal laminate and method of producing same (2002-04-23),
8. 6268070 - Laminate for multi-layer printed circuit (2001-07-31),
9. 6224722 - Method and apparatus for sequentially metalizing polymeric films and products made thereby (2001-05-01),
10. 6221176 - Surface treatment of copper to prevent microcracking in flexible circuits (2001-04-24),
11. 6171714 - Adhesiveless flexible laminate and process for making adhesiveless flexible laminate (2001-01-09),
12. 6132887 - High fatigue ductility electrodeposited copper foil (2000-10-17),
13. 6086743 - Adhesion enhancement for metal foil (2000-07-11),
14. 6042711 - Metal foil with improved peel strength and method for making said foil (2000-03-28),
15. 5969928 - Shunt for circuit protection device (1999-10-19),
Gould Electronics Inc. is a leading global provider of innovative electronic solutions. With over three decades of experience, we specialize in designing, manufacturing, and distributing a wide range of high-quality electronic components. Our commitment to exceptional quality, unmatched reliability, and customer satisfaction has made us a trusted partner for businesses worldwide. Visit our website to explore our extensive product portfolio and learn more about how we can help meet your electronic needs.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 13 2026

65 Patents

#2 in Eastlake, OH

#235 in Ohio

#5,423 in US

#11,047 in the World

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Eastlake, OH, United States of America

Gould Electronics Inc.

Forward Citations = 1,116

89 inventors:

goldMedal Thomas J Ameen (10 out of 15 patents)

silverMedal Peter Peckham (8 out of 16 patents)

bronzeMedal Adam G Bay (7 out of 15 patents)

4.  Ronald K Haines (7 out of 11 patents)

5.  Charles A Poutasse (6 out of 11 patents)

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