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Eastlake, OH, United States of America

Gould Electronics Inc.

USPTO Granted Patents = 65

% Expired Patents = 3.1

CIPO Patents = 1

Trademarks = 2

Forward Citations = 1,139

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89 inventors (with patents filed for the assignee):

Thomas J Ameen (10 out of 15 patents)

Peter Peckham (8 out of 16 patents)

Adam G Bay (7 out of 15 patents)

4. Ronald K Haines (7 out of 11 patents)

5. Charles A Poutasse (6 out of 11 patents)

6. Sidney J Clouser (6 out of 20 patents)

7. Shiuh-Kao Chiang (5 out of 9 patents)

8. Robert D DeWitt (5 out of 9 patents)

9. Mary P Rossoll (5 out of 8 patents)

10. Jiangtao Wang (4 out of 9 patents)

11. Chin-Ho Lee (4 out of 7 patents)

12. Jerry L Mosesian (3 out of 17 patents)

13. Dino F DiFranco (3 out of 10 patents)

14. Dan Lillie (3 out of 5 patents)

15. John P Callahan (3 out of 6 patents)

Core Competencies:

Copper Foil

Flexible Circuits

Multilayer Laminates

Adhesion Enhancement

Optical Fiber

Resistor Components

Lithium-Ion Batteries

Electrodeposition

Circuit Protection

Epoxy Adhesives

Metal Foil

Polymeric Films

65 patents: Sort by Forward Citations

1. 6622374 - Resistor component with multiple layers of resistive material (2003-09-23),

2. 6589413 - Method of making a copper on INVAR® composite (2003-07-08),

3. 6589381 - Coatings for improved resin dust resistance (2003-07-08),

4. 6489035 - Applying resistive layer onto copper (2002-12-03),

5. 6489034 - Method of forming chromium coated copper for printed circuit boards (2002-12-03),

6. 6447929 - Thin copper on usable carrier and method of forming same (2002-09-10),

7. 6376008 - Resin/copper/metal laminate and method of producing same (2002-04-23),

8. 6268070 - Laminate for multi-layer printed circuit (2001-07-31),

9. 6224722 - Method and apparatus for sequentially metalizing polymeric films and products made thereby (2001-05-01),

10. 6221176 - Surface treatment of copper to prevent microcracking in flexible circuits (2001-04-24),

11. 6171714 - Adhesiveless flexible laminate and process for making adhesiveless flexible laminate (2001-01-09),

12. 6132887 - High fatigue ductility electrodeposited copper foil (2000-10-17),

13. 6086743 - Adhesion enhancement for metal foil (2000-07-11),

14. 6042711 - Metal foil with improved peel strength and method for making said foil (2000-03-28),

15. 5969928 - Shunt for circuit protection device (1999-10-19),

Company Overview

Gould Electronics Inc., based in Eastlake, Ohio, specializes in advanced copper foil technology, catering to a diverse range of applications. The company focuses on the development and manufacturing of high-quality copper foil, flexible circuits, and multilayer laminates, which are essential in various electronic components. Additionally, Gould is engaged in enhancing adhesion processes, producing resistor components, and contributing to lithium-ion battery technologies through innovative electrodeposition techniques. Their expertise positions them as a key player in the electronics industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

65 Patents

#1 in Eastlake, OH

#251 in Ohio

#5,611 in US

#11,332 in the World

Eastlake, OH, United States of America

Gould Electronics Inc.

Forward Citations = 1,139

89 inventors:

Thomas J Ameen (10 out of 15 patents)

Peter Peckham (8 out of 16 patents)

Adam G Bay (7 out of 15 patents)

4. Ronald K Haines (7 out of 11 patents)

5. Charles A Poutasse (6 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Gould Electronics Inc.. Retrieved from https://idiyas.com/company/gould-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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