The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2000

Filed:

May. 24, 1996
Applicant:
Inventors:

Sidney J Clouser, Chardon, OH (US);

Rudolf Wiechmann, Freiberg, DE;

Bernd Schneider, March, DE;

Ulrike Bohmler, Emmendingen, DE;

R Duane Apperson, McConnelsville, OH (US);

Assignee:

Gould Electronics Inc., Eastlake, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
428606 ; 428607 ; 428674 ; 428544 ; 205 50 ; 205291 ;
Abstract

This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.


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