Chin-Ho Lee

Title: Innovations of Chin-Ho Lee

Introduction

Chin-Ho Lee is a notable inventor based in Lyndhurst, OH, with a remarkable portfolio of seven patents. His work primarily focuses on advancements in materials used for printed circuit boards and flexible circuits.

Latest Patents

One of his latest patents is a method of making a copper on INVAR® composite. This composite is designed for forming multi-layer printed circuit boards, consisting of an INVAR® sheet with a thickness ranging from 0.5 mil to 5 mil, and a layer of electrodeposited copper. The copper layer has a thickness between 1µ and 50µ, resulting in a composite with a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0°F and 200°F. Another significant patent involves a surface treatment of copper to prevent microcracking in flexible circuits. This invention relates to a flexible laminate that includes a first flexible polymeric film, a copper layer with a microcracking prevention layer, and a second flexible polymeric film. The microcracking prevention layer is designed to withstand extensive bending cycles, ensuring durability in flexible applications.

Career Highlights

Chin-Ho Lee has had a distinguished career, working with prominent companies such as Gould Electronics Inc. and Gould Inc. His contributions to the field of electronics and materials science have been significant, particularly in enhancing the reliability and performance of electronic components.

Collaborations

Throughout his career, Chin-Ho Lee has collaborated with notable professionals, including Edward Czapor and Ronald K Haines. These collaborations have likely contributed to the innovative advancements in his patents.

Conclusion

Chin-Ho Lee's contributions to the field of electronics through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the development of advanced materials in the industry.