The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2001

Filed:

Mar. 17, 1999
Applicant:
Inventors:

Harish D. Merchant, Hinckley, OH (US);

Charles A. Poutasse, Beachwood, OH (US);

Chin-Ho Lee, Lyndhurst, OH (US);

Assignee:

Gould Electronics, Inc., Eastlake, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 2/224 ;
U.S. Cl.
CPC ...
C23C 2/224 ;
Abstract

In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 &mgr;m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 &mgr;m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.


Find Patent Forward Citations

Quick Actions:

Merchant, Harish. (2001). Surface treatment of copper to prevent microcracking in flexible circuits (U.S. Patent No. 6221176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6221176

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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