The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Sep. 04, 1997
Applicant:
Inventors:
Chin-Ho Lee, Lyndhurst, OH (US);
Edward Czapor, Parma, OH (US);
Assignee:
Gould Electronics, Inc., Eastlake, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
205316 ; 205318 ; 205319 ; 205243 ; 205244 ; 205152 ; 205155 ; 205156 ;
Abstract
This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.