The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1991
Filed:
Aug. 24, 1990
Christopher J Whewell, Chesterland, OH (US);
Sidney J Clouser, Chardon, OH (US);
Chin-ho Lee, Lyndhurst, OH (US);
Gould Inc., Eastlake, OH (US);
Abstract
The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed from the layer of first metal. A layer of third metal is then plated upon the portions of the layer of first metal that are not covered by the photoresist. All remaining photoresist and the portions of the layer of first metal which are not covered by the third metal are then removed producing a finished fine-line pattern having conductive and insulative areas. The finished fine-line pattern may then be utilized to produce a circuit board.