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For the Inventor, By the Inventor

Haworth, NJ, United States of America

Shiuh-Kao Chiang

This inventor holds 9 USPTO granted patents and 1 EPO patent. Top assignees: Gould Electronics Inc., Ga-Tek, Inc., Gould Inc.. Active years: 1993-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shiuh-Kao Chiang. Retrieved from https://idiyas.com/inventor/shiuh-kao-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 100.0


Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 186(Granted Patents)


Location History:

  • Solon, OH (US) (1993 - 2001)
  • Haworth, NJ (US) (2000 - 2004)

Company Filing History:

goldMedal5 out of 65 
 
Gould Electronics Inc.
 patents
silverMedal1 out of 21 
 
Ga-Tek, Inc.
 patents
bronzeMedal1 out of 585 
 
Gould Inc.
 patents
4. 1 out of 10 
 
Nikko Materials USA, Inc.
 patents
5. 1 out of 834,570 
Other
 patents

Years Active: 1993-2004

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9 patents (USPTO):Explore Patents
1. 6770380 - Resin/copper/metal laminate and method of producing same (2004-08-03),
2. 6376008 - Resin/copper/metal laminate and method of producing same (2002-04-23),
3. 6248401 - Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer (2001-06-19),
4. 6171714 - Adhesiveless flexible laminate and process for making adhesiveless flexible laminate (2001-01-09),
5. 6056185 - Method of connecting batteries to electronic circuits (2000-05-02),
6. 5709957 - Metallic body with vapor-deposited treatment layer(s) and (1998-01-20),
7. 5431803 - Electrodeposited copper foil and process for making same (1995-07-11),
8. 5372297 - Drum cathode for use in the production of metal foils and a method of (1994-12-13),
9. 5240582 - Drum cathode for use in the production of metal foils and a method of (1993-08-31),

Title: Shiuh-Kao Chiang: Innovator in Resin/Copper/Metal Laminate Technology

Introduction

Shiuh-Kao Chiang is a notable inventor based in Haworth, NJ (US), recognized for his contributions to the field of laminate technology. With a total of nine patents to his name, he has made significant advancements in the production of printed circuit boards.

Latest Patents

One of his latest patents is titled "Resin/Copper/Metal Laminate and Method of Producing Same." This innovative laminate is designed for use in the production of printed circuit boards. It comprises a metal layer with a first side and a second side, a metallic substrate attached to the first side of the metal foil, and an adhesive substrate made of polymeric material. The adhesive substrate has a first surface attached to the second side of the copper foil and is at least partially uncured. Additionally, a releasable protective film is positioned along the second surface of the adhesive substrate.

Career Highlights

Throughout his career, Shiuh-Kao Chiang has worked with various companies, including Gould Electronics Inc. His expertise in laminate technology has positioned him as a key figure in the industry.

Collaborations

Shiuh-Kao Chiang has collaborated with notable individuals such as Mary K Prokop and Tibor Kalnoki-Kis, contributing to the advancement of technology in his field.

Conclusion

Shiuh-Kao Chiang's innovative work in resin/copper/metal laminate technology has made a lasting impact on the production of printed circuit boards. His contributions continue to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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