Gould Electronics Inc.

Other

Gould Inc.

Ga-tek, Inc.

Nikko Materials Usa, Inc.

Shiuh-Kao Chiang

Mary K Prokop

Adam G Bay

Tibor Kalnoki-Kis

R Richard Steiner

Jamie H Chamberlain

Dino F DiFranco

Mark L Daroux

Craig J Hasegawa

David A Glover

Tad Bergstresser

David B Russell

John A Centa

Nicholas E Bergkessel

Robert Reichert

A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.

Resin/copper/metal laminate and method of producing same

This invention relates to a metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material overlying and adhered to at least one treatment layer, provided that when two treatment layers are deposited on one side of the body and the first layer is vapor-deposited zinc, the second layer is not vapor-deposited silica or alumina, said adhesion-promoting material being suitable for enhancing adhesion between said body and another substrate. The invention also relates to laminates comprising metal foils and at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal foil; a layer of adhesion-promoting material overlying and adhered to at least one vapor-deposited treatment layer; and a layer of an electrically non-conductive material overlying and adhered to the adhesion-promoting layer.

Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer

This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Adhesiveless flexible laminate and process for making adhesiveless flexible laminate

A method of securing a metal lead of a polymer battery to a flexible circuit, comprising the steps of positioning a metal lead of a polymer electrolyte battery onto a connection pad of a circuit; clamping the metal lead and the connection pad between two weld fixtures of an ultrasonic welder; compressing the metal lead and connection pad between the two weld fixtures to establish a pressure of about 44.9 psi to about 30.8 psi; and vibrating the weld fixtures at a frequency of about 20 kHz for about 0.1 seconds to about 2.0 seconds.

Method of connecting batteries to electronic circuits

A metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material overlying and adhered to at least one treatment layer, provided that when two treatment layers are deposited on one side of the body and the first layer is vapor-deposited zinc, the second layer is not vapor-deposited silica or alumina, the adhesion-promoting material being suitable for enhancing adhesion between the body and a substrate. Laminates comprising metal foils and at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal foil; a layer of adhesion-promoting material overlying and adhered to at least one vapor-deposited treatment layer; and a layer of an electrically non-conductive material overlying and adhered to the adhesion-promoting layer.

Metallic body with vapor-deposited treatment layer(s) and

This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one embodiment this foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi and an elongation measured at 180.degree. C. of about 15% to about 28%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) flowing an electrolyte solution between an anode and a cathode and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; said electrolyte solution comprising copper ions, sulfate ions and at least one organic additive or derivative thereof, the chloride ion concentration of said solution being up to about 1 ppm; the current density being in the range of about 0.1 to about 5 A/cm.sup.2 ; and (B) removing copper foil from said cathode.

Electrodeposited copper foil and process for making same

The present invention provides a new and improved titanium metal drum cathode for use in the production of metal foils and a novel method of making the same. The method includes the steps of welding together the ends of a strip of titanium that has been roll formed into a cylinder. During the welding operation some of the weld beads that form the weld are hot peened immediately upon solidification. Upon complete formation of the weld, the formed and welded trip of titanium is subjected to a heat treating cycle that includes a double anneal. Preferably, the strip of titanium metal and the weld metal that is used to form the weld both comprise an addition agent such as yttria.

Growing community of inventors

Haworth, NJ, United States of America

Shiuh-Kao Chiang